Application:
Suitable for high-end electronic components, circuit boards, batteries, shielding materials, heat dissipation materials, and conductive materials.
Applicable in flexible copper-clad laminates (FCCL), flexible printed circuits (FPC), 5G communications, electromagnetic shielding, heat dissipation substrates, graphene film fabrication, aerospace, lithium batteries, LEDs, smart vehicles, drones, wearable electronics, and other industry fields.